Bulletins

India opens Semicon 2.0 applications for materials, fabs and chip packaging

On 6 November, the Ministry of Electronics and Information Technology opened the Semicon 2.0 application portal for Pillars 2, 3 and 4 covering machinery and materials, additional fabrication plants and assembly, testing, marking and packaging. The ministry also announced 12 approved applicants under the separate Electronics Components Manufacturing Scheme. It cited a previously approved ₹1,27,500-crore Semicon 2.0 outlay. Opening an application window does not mean fresh projects under these pillars have been approved or commissioned.

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01 / 03

India and EU conclude negotiations for Indian association with Horizon Europe

India and the EU have concluded negotiations on association with Horizon Europe, which could widen Indian participation in European research calls. Completion of talks is not the same as membership taking legal effect.

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01 / 01